IST America to to Showcase New swap4curePlatformat Pack Expo International
IST America, the North American division of global UV and LED curing technology leader IST METZ, will showcase its newly introduced swap4cure platform in booth Booth W 38060 at PACK EXPO International 2026, taking place October 18–21 at McCormick Place in Chicago. IST America will co-exhibit with sister company IST InTech, bringing together a broad portfolio of UV, LED UV and specialized curing solutions for packaging, printing and industrial applications.
At the center of IST America’s presence will be swap4cure, a new modular curing and drying platform designed to give manufacturers greater flexibility as inks, coatings, substrates and production requirements continue to change.
Built around a common system architecture, swap4cure allows users to interchange curing and drying technologies within the same platform rather than permanently committing equipment to a single process. Depending on the application, the platform can accommodate conventional UV, LED UV and thermal drying using infrared and warm air, with a pathway toward future technologies including IST’s FREEcure.
“Packaging producers are being asked to adapt to new materials, chemistries, sustainability requirements and customer demands, often without knowing exactly what their production environment will look like several years from now,” said Errol Moebius, President/CEO, IST America. “swap4cure gives them the flexibility to select the curing technology that makes sense today while maintaining a platform designed to adapt as those requirements change.”
The standardized platform uses interchangeable cassette technology supported by a common housing, power supply, cable and control architecture. In addition to simplifying technology changes, the design supports easier maintenance, service and future upgrades.
Alongside swap4cure, IST America will highlight its broader portfolio of UV and LED UV technologies, including LEDcure NX, FREEcure, SMARTcure and Excimer solutions. IST InTech will complement the exhibit with curing technologies developed specifically for digital applications. Together, the companies will demonstrate how IST’s range of technologies can support applications across packaging, printing and industrial manufacturing.
Visitors can meet with IST America and IST InTech at Booth W 38060 during PACK EXPO International, October 18–21, 2026, at McCormick Place in Chicago.
